As a central facility of the Institute, the Nanostructuring Lab offers tools and equipment for sample processing and characterization under cleanroom conditions. These are usually operated by the NSL users – after being trained - on their own.

Requesting Access to NSL Service:
  • Application form for MPI-FKF contract holders (pdf)
  • Application form for MPI-FKF externals (University, MPI-IS, ...) (pdf)

The application form - filled by the applicant and the department director/university professor – should be passed in to the NSL team. Together with the NSL team, the further steps will be discussed.

Any requests or questions?
Please contact the NSL team via   .


Electron Beam Lithography

Electron Beam Lithography


– 100 kV Electron Beam Writer (JEOL JBX6300FS) under Stable Environmental
    Conditions (Magnetic Field, Temperature, Humidity)
– SEM-based Electron Beam Writer with Interferometer-controlled Sample Stage
    (Raith eLine, Raith eLine plus)
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)
Optical Lithography

Optical Lithography


– Mask Design
– Mask Aligner for Exposure (Karl Suess MA 6 and MJB 3)
– Direct Laser Writer (Kloé Dilase 250)
– Diverse Positive- and Negative-tone Resists are available
 
Complex Sample Preparation with Focused Ga Ion Beam

Complex Sample Preparation with Focused Ga Ion Beam


Scanning Electron Microscope Combined with Focused Ion Beam, Micromanipulators and Gas Injection (Zeiss Crossbeam)
– TEM Lamella Preparation 
– Shaping of Functional Devices from Micro-crystals
– Positioning of (Sub-)Micron Sized Objects
 
Imaging from Micro- to Centimeter Scale

Imaging from Micro- to Centimeter Scale


– Photo Camera Setups (Nikon)
– Stereo Microscopes (Nikon)
– Optical Microscopes (Nikon)
– Digital Microscopes (Olympus), also in Ar-Glovebox
 
Imaging and Analytics down to Nanometer Scale

Imaging and Analytics down to Nanometer Scale


Scanning Electron Microscopes (Zeiss Merlin, Zeiss Gemini SEM 500) with
 – EDX, EBSD (Oxford Instruments)
 – EBIC
 – in-situ Scanning Probe Microscopy (Semilab)   
 – Micromanipulation Tools (Kleindiek)
 – Sample Loading from Vacuum Shuttle
Plasma-enhanced Etching

Plasma-enhanced Etching


– ICP-RIE with Fluorine, Chlorine, and Bromine Chemistry  
    (Oxford Instruments PlasmaPro 100 Cobra)
    (Sentech SI 500 with Option of Sample Loading from Ar-Glovebox)
– Bosch-like Etching Process
 
Atomic Layer Deposition

Atomic Layer Deposition


– Water-based Atomic Layer Deposition (Ti-, Hf-, Al-oxides) 
    (Cambridge Nanotechnology Shavanna 100)
– Plasma-enhanced Atomic Layer Deposition (PE-ALD) (Oxide, Nitride, Sulfide, Metal)
    (Sentech ALD with Real-time Monitoring)
– ICP-RIE and PE-ALD within one Vacuum Cluster for Surface Treatment /
    Passivation / Encapsulation / Electrical Isolation (Sentech)
Wetbenches and Fume Hoods

Wetbenches and Fume Hoods


– Various Chemical Working Places for Spin Coating, Resist Developing,
    Wet Etching, Lift-Off, Sample Cleaning, Exfoliation, …
– Chemical Fume Hood with Ultrasound Bath for Cleaning Large UHV Parts
– Sample and Substrate Cleaning in Megasound Bath
 
Material Deposition

Material Deposition


– Thin Film Sputtering (Leica ACE600)
– Thermal Evaporation (Leybold Univex Systems)
– Thermal Atomic Layer Deposition (Cambridge Nanotechnology Shavanna 100)
– UHV Aluminum Deposition with Controlled in-situ Oxidation
– Exfoliation of 2D Material Flakes
Auxiliary Tools for Processing

Auxiliary Tools for Processing


– Wire Bonding (Wedge and Glue Bonding)
– GHz Plasma Cleaner (Diener)
– Annealing Oven (Dr. Eberl-MBE-Komponenten)
– Pyrolytic Cleaning Oven
– Critical Point Dryer (Leica EM CPD300)  
Auxiliary Tools for Mechanical Preparation

Auxiliary Tools for Mechanical Preparation


– Target Preparation Tool for Milling, Sawing, Grinding and Polishing Samples
    (Leica EM TPX)
– Cross Section Polisher (JEOL IB-091010CP)
– Diamond Scratcher for Separating Chips from a Wafer (Karl Suess)
 
Auxiliary Tools for Characterization

Auxiliary Tools for Characterization


– Profilometer (Veeco Dektak 8)
– Ellipsometer (Sentech SENResearch)
– Needle Probe Station
– Vacuum Scanning Probe Microscope (AFM/STM) with Load-Lock for Sample and
   Tip Exchange (Semilab)
Sample Characterization and Processing Excluding Air

Sample Characterization and Processing Excluding Air


– Argon Gloveboxes (with Automated High-end Optical Microscope Olympus DSX510)
– Vacuum Shuttle Connection (Vacuum-connected Network of SEM, FIB, Material
    Sputtering)
– Plasma-enhanced Reactive Ion Etching and Atomic Layer Deposition with Sample
    Loading from Ar-Glovebox
Software Tools

Software Tools


– Monte-Carlo-Simulation of Electron Scattering in Materials
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)
– 3D Data Analysis and Visualization (Avizo)
 
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