As a central facility of the Institute, the Nanostructuring Lab offers tools and equipment for sample processing and characterization under cleanroom conditions. These are usually operated by the NSL users – after being trained - on their own.

Requesting Access to NSL Service:
  • Application form for MPI-FKF contract holders (pdf)
  • Application form for MPI-FKF externals (University, MPI-IS, ...) (pdf)

The application form - filled by the applicant and the department director/university professor – should be passed in to the NSL team. Together with the NSL team, the further steps will be discussed.

Any requests or questions?
Please contact the NSL team via   .


<p>Electron Beam Lithography</p>

Electron Beam Lithography


– 100 kV Electron Beam Writer (JEOL JBX6300FS) under Stable Environmental
    Conditions (Magnetic Field, Temperature, Humidity)
– SEM-based Electron Beam Writer with Interferometer-controlled Sample Stage
    (Raith eLine)
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)

 

<p>Optical Lithography</p>

Optical Lithography


– Mask Design
– Mask Aligner for Exposure (Karl Suess MA 6 and MJB 3)
– Direct Laser Writer (Kloé Dilase 250)
– Diverse Positive- and Negative-tone Resists are available

 

<p>Complex Sample Preparation with Focused Ga Ion Beam</p>

Complex Sample Preparation with Focused Ga Ion Beam


Scanning Electron Microscope Combined with Focused Ion Beam, Micromanipulators and Gas Injection (Zeiss Crossbeam)

– TEM Lamella Preparation
– Shaping of Functional Devices from Micro-crystals
– Positioning of (Sub-)Micron Sized Objects

<p>Imaging from Micro- to Centimeter Scale</p>

Imaging from Micro- to Centimeter Scale


– Photo Camera Setups (Nikon)
– Stereo Microscopes (Nikon)
– Optical Microscopes (Nikon)
– Digital Microscopes (Olympus), also in Ar-Glovebox

 

Imaging and Analytics down to Nanometer Scale

Imaging and Analytics down to Nanometer Scale


Scanning Electron Microscopes (Zeiss Merlin, Zeiss Gemini 500) with
      – EDX, EBSD (Oxford Instruments)
      – EBIC
      – in-situ Scanning Probe Microscopy (Semilab)   
      – Micromanipulation Tools (Kleindiek)
      – Sample Loading from Vacuum Shuttle

<p>Plasma-enhanced Etching</p>

Plasma-enhanced Etching


– ICP-RIE with Fluorine, Chlorine, and Bromine Chemistry  
    (Oxford Instruments PlasmaPro 100 Cobra)
    (Sentech SI 500 with Option of Sample Loading from Ar-Glovebox, in Fall 2020)
– Bosch-like Etching Process

 

Atomic Layer Deposition

Atomic Layer Deposition


– Water-based Atomic Layer Deposition (Ti-, Hf-, Al-oxides) 
    (Cambridge Nanotechnology Shavanna 100)
– Plasma-enhanced Atomic Layer Deposition (PE-ALD) (Oxide, Nitride, Sulfide, Metal)
    (Sentech ALD with Real-time Monitoring, in Fall 2020)
– ICP-RIE and PE-ALD within one Vacuum Cluster for Surface Treatment /
    Passivation / Encapsulation / Electrical Isolation (Sentech, in Fall 2020)

<p>Wetbenches and Fume Hoods</p>

Wetbenches and Fume Hoods


– Various Chemical Working Places for Spin Coating, Resist Developing,
    Wet Etching, Lift-Off, Sample Cleaning, Exfoliation, …
– Chemical Fume Hood with Ultrasound Bath for Cleaning Large UHV Parts


 

<p>Material Deposition</p>

Material Deposition


– Thin Film Sputtering (Leica ACE600)
– Thermal Evaporation (Leybold Univex Systems)
– Atomic Layer Deposition (Cambridge Nanotechnology Shavanna 100)
– UHV Aluminium Deposition with Controlled in-situ Oxidation

 

<p>Auxiliary Tools for Processing</p>

Auxiliary Tools for Processing


– Wire Bonding (Wedge and Glue Bonding)
– GHz Plasma Cleaner (Diener)
– Annealing Oven (Dr. Eberl-MBE-Komponenten)
– Pyrolytic Cleaning Oven
– Critical Point Dryer (Leica EM CPD300)

 

Auxiliary Tools for Mechanical Preparation

Auxiliary Tools for Mechanical Preparation


– Target Preparation Tool for Milling, Sawing, Grinding and Polishing Samples
    (Leica EM TPX)
– Cross Section Polisher (JEOL IB-091010CP)
– Diamond Scratcher for Separating Chips from a Wafer (Karl Suess)

 

Auxiliary Tools for Characterization

Auxiliary Tools for Characterization


– Profilometer (Veeco Dektak 8)
– Ellipsometer (Sentech SENResearch)
– Needle Probe Station
– Vacuum AFM/STM with Load-Lock for Sample and Tip Exchange (Semilab)

 

<p>Sample Characterization and Processing Excluding Air</p>

Sample Characterization and Processing Excluding Air


– Argon Gloveboxes (with Automated High-end Optical Microscope, Olympus DSX510)
– Vacuum Shuttle Connection (Vacuum-connected Network of SEM, FIB, Material
    Sputtering)
– Plasma-enhanced Reactive Ion Etching and Atomic Layer Deposition with Sample
    Loading from Ar-Glovebox (in Fall 2020)

 

<p>Software Tools</p>

Software Tools


– Monte-Carlo-Simulation of Electron Scattering in Materials
– Proximity Corrections for Electron Beam Lithography (Genisys Beamer)
– 3D Data Analysis and Visualization (Avizo)


 

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