Organic integrated circuits

Together with expert circuit designers at Stanford University and at the Institute for Microelectronics Stuttgart (IMS Chips) we have fabricated various mixed-signal integrated circuits based on low-voltage organic thin-film transistors, including a 6-bit C-2C digital-to-analog converter (DAC) in a complementary technology, a 6-bit C-2C analog-to-digital converter (ADC) in a complementary technology, a 6-bit current-steering digital-to-analog converter in a unipolar technology, and a 3-stage shift register in a unipolar technology.

6-bit C-2C DAC
(W. Xiong & B. Murmann, Stanford University)
6-bit C-2C ADC
(W. Xiong & B. Murmann, Stanford University)
6-bit current-steering DAC
(T. Zaki & H. Richter, IMS Chips)
3-stage shift register
(M. Elsobky & H. Richter, IMS Chips)


Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies
M. Elsobky, Y. Mahsereci, Z. Yu, H. Richter, J. N. Burghartz, J. Keck, H. Klauk, U. Zschieschang
Electronics Letters, vol. 54, no. 6, pp. 338-340, March 2018

A digital library for a flexible low-voltage organic thin-film transistor technology
M. Elsobky, M. Elattar, G. Alavi, F. Letzkus, H. Richter, U. Zschieschang, M. Strecker, H. Klauk, J. N. Burghartz
Organic Electronics, vol. 50, pp. 491-498, November 2017

A 3.3 V 6-Bit 100 kS/s Current-Steering Digital-to-Analog Converter Using Organic P-Type Thin-Film Transistors on Glass
T. Zaki, F. Ante, U. Zschieschang, J. Butschke, F. Letzkus, H. Richter, H. Klauk, J. N. Burghartz
IEEE Journal of Solid-State Circuits, vol. 47, no. 1, pp. 292-300, January 2012

A 3V, 6b Successive Approximation ADC using Complementary Organic Thin-Film Transistors on Glass
W. Xiong, U. Zschieschang, H. Klauk, B. Murmann
2010 IEEE International Solid State Circuits Conference, pp. 134-135, February 2010

A 3-V, 6-Bit C-2C Digital-to-Analog Converter Using Complementary Organic Thin-Film Transistors on Glass
W. Xiong, Y. Guo, U. Zschieschang, H. Klauk, B. Murmann
IEEE Journal of Solid-State Circuits, vol. 45, no. 7, pp. 1380-1388, July 2010

 
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